Posted on 2018-07-11 Diamond wire cutting fluid is a new type of product. It is mainly used for the cutting of corundum wire of non-metallic brittle hard materials such as monocrystalline silicon and polycrystalline silicon. It has excellent lubrication, cooling, anti-corrosion, anti-rust and hydrogen suppression functions. The surface of the silicon wafer has a small TTV, wireless marks, and can extend the life of the diamond wire.
Advantage:
1．Unique patented technology suppresses and eliminates chip silicon powder during cutting, avoiding the safety hazards caused by prolonged production accumulation.
2．Excellent lubricating effect can effectively prevent brittle cracking or scratching of the silicon wafer during the cutting process, reduce the surface roughness and surface warpage of the silicon wafer, and minimize the total thickness deviation of the processed silicon wafer;
3．Excellent anti-corrosion and anti-rust properties, protect equipment from corrosion in acidic environment;
4．Excellent additives to ensure the longevity of the diamond wire;
5．For better recovery, the chip silicon powder and the cutting liquid can be simply treated and reused by centrifugation and sedimentation, thereby effectively reducing the production cost.
6．Easy to clean after cutting
Post time: Jan-13-2022